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Analysis of China’s First 3D Layer NAND Flash from YMTC Announced by TechInsights

OTTAWA, CANADA / AGILITYPR.NEWS / March 25, 2020 / TechInsights maintains the world’s largest database of semiconductor and advanced technology analysis.


TechInsights, global leaders in the reverse engineering of semiconductors in advanced technology products, announced they are conducting considerable analysis on the Yangtze Memory Technologies Co.’s 3D 64L Xtacking TLC NAND device.


“This 64L 3D NAND flash device represents the first major competitive semiconductor product to come out of China’s state-backed investment in cutting-edge memory chips,” said Gavin Carter, CEO of TechInsights.


“There is no question that this will disrupt the ~52 billion-dollar NAND memory market and its respective market leaders Samsung, Kioxia, Western Digital, Micron, Intel, and SK hynix.”


YMTC’s 64L 3D NAND device is a disruptor not only because it is offered by a significant new entrant, but because of its Xtacking architecture.


Xtacking architecture offers higher array efficiency and memory bit density than conventional 3D NAND solutions, such as Samsung’s 64L V-NAND and KIOXIA/Western Digital’s 64L BiCS NAND. Additionally, YMTC Xtacking uses Wafer-to-Wafer hybrid bonding technology, so the NAND array is upside-down on periphery circuits.


TechInsights has considerable analysis underway for this part, including:


  • Floorplan – Top metal and polysilicon planar die image, SEM X-section, process proof, floorplan analysis and die utilization including block sizes and functionality, die and package cost
  • Peripheral design - Plan view SEM image set with hierarchical schematics of target blocks
  • Structural and materials - SEM planar and X-sections, TEM EDS and EELS, SCM, SIMS and other advanced techniques of structural and material analysis
  • Process flow - Process flow steps and 3D emulations of advanced semiconductor technologies.
  • Circuit reverse engineering- Hierarchical schematics demonstrate the design from the block down to gate level - all linked to the original layout, showing the extracted gates and associated interconnects.


If you are interested in TechInsights analysis on the YMTC 64L 3D NAND you can download our product brief which includes an overview of our analysis, images of the device, as well as a discussion of the Xtacking architecture.

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TechInsights maintains the world’s largest database of semiconductor and advanced technology analysis. By revealing the innovation others cannot inside the broadest range of advanced technology products, we prove patent value and enable business leaders to make the best, fact-based IP and technology investment decisions. Headquartered in Ottawa Canada, TechInsights’ purpose is to support a fair global marketplace where semiconductor and electronics IP can be created and monetized. For more information on TechInsights, visit the website.

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TechInsights

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